20 oz. Foam Gel Sub-Floor Wood Adhesive with Temp. Range (F) of -40° to 195°F
- Item # 31ER22
- My Part #
- Mfr. Model # 00036
- Catalog Page # N/A
- UNSPSC # 31201601
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- Item Sub-Floor Wood Adhesive
- Type Foam Gel
- Size 20 oz.
- Net Weight (Oz.) 20
- Temp. Range (F) -40 Degrees to 195 Degrees F
- Begins to Harden 20 min.
- Curing Time 24 hr.
- Bonding Range 24 hr.
- Substrates Wet, Frozen and Treated Lumber, OSB, Enhanced OSB, Wood, Glued Floor Systems, Plywood
- Application Subfloor and Deck Gluing, Wood to Wood Application, Frozen and Treated Lumber Applications
- Characteristics High Yield Per Can, Foam to Gel, Polyurethane Based, VOC Compliant In All 50 States
- Standards ASTM D3498
Compliance and Restrictions
Hazardous material - Other Regulated Material
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